A.期刊論文
1. C.-C. Chen, W. Gierlotka and *S.-W. Chen, "Phase Equilibria of Sn-V System and Interfacial Reactions in Sn/V couples", submitted to a refereed journal for publication. (NSC95-2218-E007-028)
2. C.-H. Wang and *S.-W. Chen, "Interfacial reactions in Sn-(Cu)/Cu6Sn5/Ni couples at 210oC", submitted to a refereed journal for publication. (NSC95-2221-E-007-205)
3. Y.-H. Chao, *S.-W. Chen, C.-H. Chang and C.-C. Chen, 2007, "Phase equilibria of Sn-Co-Ni system and interfacial reactions in Sn/(Co, Ni) couples", submitted to a refereed journal for publication. (NSC95-2221-E-007-205)
4. C.-H. Wang and *S.-W. Chen, 2007, "Cruciform pattern formation in Sn/Co couples", submitted to a refereed journal for publication. (NSC95-2218-E-007-028)
5. W. Gierlotka and *S.-W. Chen, 2007, "Thermodynamic descriptions of the Cu-Zn system", submitted to a refereed journal for publication. (NSC95-2221-E-007-205)
6. W. Gierlotka, *S.-W. Chen and S.-K. Lin, 2007, "Phase equilibria of the Cu-Sn system", Journal of Materials Research, (accepted for publication). (NSC95-2221-E-007-205)
7. S.-K. Lin, Y. Yorikado, J. Jiang, K.-S. Kim, *K. Suganuma, *S.-W. Chen, M. Tsujimoto and I. Yanada, 2007, "Microstructure development of mechanical deformation-induced tin whiskers ", submitted to a refereed journal for publication.
8. C.-C. Chen, *S.-W. Chen and C.-H. Chang, “Electromigration effects upon the Sn/Ni-7wt.%V interfacial reactions”, submitted to a refereed journal for publication. (NSC95-2218-E007-028)
9. C.-N. Chiu, C.-H. Wang and *S.-W. Chen, 2007, “Interfacial reactions in the Sn-Bi/Te couples”, Journal of Electronic Materials”, Journal of Electronic Materials, (accepted for publication). (NSC95-2218-E-007-028)
10. Y.-C. Huang, *S.-W. Chen, C.-H. Chang, J.-C. Wu and W. Gierlotka, 2007, “Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders”, Journal of Materials Research, (accepted for publication). (NSC95-2221-E-007-205)
11. C.-F. Yang, *S.-W. Chen, K.-H. Wu and T.-S. Chin, 2007, “Interfacial reactions of Sn-8wt.%Zn-3wt.%Bi solder with Cu, Ni and Ag substrates”, Journal of Electronic Materials, (accepted for publication). (NSC95-2218-E-007-028)
12. C.-M. Hsu, *D. S.-H. Wong, and S.-W. Chen, 2007, “A Generalized Phenomenological Model for the Effect of Electromigration on Interfacial Reaction”, Journal of Applied Physics, (accepted for publication).
13. *S.-W. Chen, C.-N. Chiu and K.-C. Hsieh, 2007, "Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the 210oC", Journal of Electronic Materials, (accepted for publication). (NSC 93-2214-E-007-001)
14. S.-K. Lin, Y. Yorikado, J. Jiang, K.-S. Kim, *K. Suganuma, *S.-W. Chen, M. Tsujimoto and I. Yanada, 2007, "Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging", Journal of Materials Research, (accepted for publication).
15. *S.-W. Chen, C.-C Chen and C.-H. Chang, 2007, "Interfacial Reactions in Sn/Ni-7wt.%V Couple", Scripta Materialia, Vol. 56(6), pp.453-456, (NSC94-2216-E007-047).
16. *S.-W. Chen and C.-H. Wang, 2007, "Effects of electromigration on interfacial reactions in cast Sn/Cu joints", Journal of Materials Research, Vol. 22(3), pp. 695-702, (NSC94-2216-E-007-047)
17. *S.-W. Chen and C.-C. Chen, 2007, "Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250oC”, Journal of Electronic Materials, (accepted for publication). (NSC93-2216-E007-043)
18. *S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu and C.-C. Chen, 2007, "Phase transformation and microstructural evolution in the solder joints", JOM, Vol. 59(1), pp. 41-45. (NSC94-2214-E-007-006)
19. *S.-W. Chen and C.-N. Chiu, 2007, "Unusual cruciform pattern interfacial reactions in the Sn/Te couples", Scripta Materialia, Vol. 56(2), pp. 97-99, (NSC94-2216-E007-047).
20. *S.-W. Chen, C.-H. Wang, S.-K. Lin and C.-N. Chiu, 2007, "Phase Diagrams of Pb-Free Solders and their Related Materials Systems”, Journal of Materials Science: Materials in Electronics, (invited review), Vol. 18, pp. 19-37. (NSC94-2214-E-007-006)
21. *S.-W. Chen and S.-K. Lin, 2006, "Electric Current-Induced Abnormal Cu/g-InSn4 Interfacial Reactions", Journal of Materials Research, Vol. 21(12), pp. 3065-3071, (NSC 94-2214-E-007-006).
22. *S.-W. Chen, P.-Y. Chen and C.-H. Wang, 2006, "Melting point lowering of the Sn-Sb alloys caused by substrate dissolution”, Journal of Electronic Materials, Vol. 35(11), pp. 1982-1985. (NSC94-2214-E-007-006).
23. C.-L. Yang, F.-L. Chen and *S.-W. Chen, 2006, "Anodization of the dental arch wires", Materials Chemistry and Physics, Vol. 100, pp. 268-274. (NSC 93-2214-E-007-001)
24. Y.-C. Huang, *S.-W. Chen, C.-H. Chang and C.-C. Wu, 2006, ”Thermal spray processes and heat treatments of thermal sprayed objects” (in Chinese), Chemical Engineering, Vol. 53(3), pp. 69-77. (NSC94-2214-E-007-006).
25. *S.-W. Chen and C.-H. Wang, 2006, "Interfacial reactions of Sn-Cu/Ni couples at 250°C”, Journal of Materials Research, Vol. 21(9), pp. 2270-2277. (NSC94-2214-E-007-006).
26. C.-C. Chen and *S.-W. Chen, 2006, "The Sn/Ni-7wt.%V interfacial reactions", Journal of Electronic Materials, Vol. 35(9), pp. 1701-1707. (NSC93-2216-E-007-043)
27. C.-C. Chen, *S.-W. Chen and C.-Y. Kao, 2006, "Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-rich corner", Journal of Electronic Materials, Vol. 35(5), pp. 922-928. (NSC93-2216-E007-043)
28. S.-K. Lin and *S.-W. Chen, 2006, “Interfacial reactions in the Sn-20at%In/Cu and Sn-20at%In/Ni couples at 160oC”, Journal of Materials Research, Vol. 21(7), pp. 1712-1717. (NSC-94-2214-E-007-006)
29. C.-Y. Chou, *S.-W. Chen and Y.-S. Chang, 2006, "Interfacial Reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni Couples", Journal of Materials Research, Vol. 21(7), pp. 1849-1856. (NSC93-2214-E-007-001)
30. *S.-W. Chen and S.-K. Lin, 2006, "Effects of temperature on interfacial reactions in g-InSn4/Ni couples", Journal of Materials Research, Vol. 21(5), pp. 1161-1166. (NSC-94-2214-E-007-006)
31. *S.-W. Chen, C.-L. Yang and C.-W. Lin, 2006, “Colorful Dental Archwires”, Journal of the Chinese Institute of Chemical Engineers, Vol. 37(2), pp. 193-194, (NSC-92-2214-E-007-002).
32. C.-Y. Chou and *S.-W. Chen, 2006, "Phase Equilibria of the Sn-Zn-Cu Ternary System", Acta Materialia, Vol. 54(9), pp. 2393-2400. (NSC93-2214-E-007-001)
33. C.-H. Wang and *S.-W. Chen, 2006, "Electric current effects in the flip chip solder joints", Journal of the Chinese Institute of Chemical Engineers, Vol. 37(2), pp. 185-191, (NSC93-2214-E-007-001).
34. *S.-W. Chen, S.-K. Lin, and C.-F. Yang, 2006, " Interfacial Reactions in the Pb-Free Composite Solders with Indium Layers”, Journal of Electronic Materials, Vol. 35(1), pp. 72-75. (NSC92-2214-E-007-022).
35. C.-Y. Chou and *S.-W. Chen, 2006, "Interfacial reactions and phase equilibria in the Al-Cu/Ta systems", Journal of Electronic Materials, Vol. 35(1), pp. 22-27. (NSC93-2214-E-007-001)
36. C.-H. Wang and *S.-W. Chen, 2006, "Sn-0.7wt%Cu/Ni interfacial reactions at 250oC", Acta Materialia, Vol. 54(1), pp. 247-253. (NSC 93-2216-E-007-043).
37. C.-N. Chiu, Y.-C. Huang, A.-R. Zi and *S.-W. Chen, 2005, "Isoplethal sections of the liquidus projection and the 250oC phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-rich corner", Materials Transactions, Vol. 46(11), pp. 2426-2430. (NSC93-2214-E-007-001) (Impact factor: 1.159, 2003)
38. *S.-W. Chen, 2005, "Phase transformation and formations of significant importance", JOM, Vol. 57(9), p. 18. (NSC 93-2216-E-007-043).
39. *S.-W. Chen, C.-L. Yang, C.-W. Lin and F.-L. Chen, 2005, “Materials for Dental Arch Wires” (in Chinese), Chemical Engineering, Vol. 52(4), pp. 113-118. (NSC 93-2214-E-007-001)
40. C.-A. Chang, *S.-W. Chen, C.-N. Chiu and Y.-C. Huang, 2005, “Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system”, Journal of Electronic Materials, Vol. 34(8), pp. 1135-1142. (NSC92-2214-E-007-002). (Impact factor: 1.457, 2003).
41. C.-M. Chen, *S.-W. Chen, J.-J. Ko, and H.-P. Pu, 2004, “Effects of Au and Ni layers on the interfacial reactions of the flip chip solder joints" (in Chinese), Journal of the Chinese Colloid and Interface Society, Vol. 26, pp. 119-128.
42. *S.-W. Chen and C.-A. Chang, 2004, “Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-rich corner”, Journal of Electronic Materials, Vol. 33(10), pp. 1071-1079, (NSC92-2214-E007-002). (Impact factor: 1.457, 2003)
43. *S.-W. Chen, J.-I Lee and C.-N. Chiu, 2004, “Liquidus projection of the ternary As-Sn-Te system”, Scripta Materialia, Vol. 51(9), pp. 853-856. (NSC91-2214-E-007-013). (Impact factor: 1.633, 2003)
44. Y.-W. Yen and *S.-W. Chen, 2004, “Phase Equilibria of the Ag-Sn-Cu Ternary System”, Journal of Materials Research, Vol. 19(8), pp. 2298-2305. (NSC89-2214-E-007-006). (Impact factor: 1.635, 2003)
45. *S.-W. Chen, H.-F. Hsu and C.-W. Lin, 2004, “Liquidus projection of the ternary Ag-Sn-Ni alloys”, Journal of Materials Research, Vol. 19(8), pp. 2262-2267. (NSC 91-2214-E-007-013). (Impact factor: 1.635, 2003)
46. *S.-W. Chen, S.-K. Lin and C.-Y. Chou, 2004, ”Investigation of reactive wetting” (in Chinese), Journal of the Chinese Colloid and Interface Society, Vol. 26(2), pp. 83-88. (NSC92-2214-E-007-002).
47. H.-F. Hsu and *S.-W. Chen, 2004, “Phase equilibria of the Sn-Ag-Ni ternary system and interfacial reactions at the Sn-Ag/Ni joints”, Acta Materialia, Vol. 52(9), pp. 2541-2547. (SCI, EI) (NSC91-2214-E-007-013). (Impact factor: 3.059, 2003)
48. *S.-W. Chen, S.-K. Lin and J.-M. Jao, 2004, “Electromigration effects upon interfacial reactions in the flip-chip solder joints”, Materials Transactions JIM, Vol. 45(3), pp. 661-665, (NSC91-2214-E-007-013). (Impact factor: 1.159, 2003)
49. M.-Y. Du, C.-M. Chen and *S.-W. Chen, 2003, "Effects upon interfacial reactions by electric currents of reversing directions", Materials Chemistry and Physics, Vol. 82(3), pp. 818-825. (SCI, EI), (NSC89-2214-E-007-006). (Impact factor: 1.183, 2003)
50. *S.-W. Chen, S.-H. Wu and S.-W. Lee, 2003, “Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu and Sn/(Cu,Ni) systems”, Journal of Electronic Materials, Vol. 32(11), pp. 1188-1194. (SCI, EI), (NSC91-2214-E-007-013). (Impact factor: 1.457, 2003)
51. *S.-W. Chen, S.-W. Lee and M.-C. Yip, 2003, “Mechanical Properties and Intermetallic Compound Formation at the Sn/Ni and Sn-0.7wt%Cu/Ni Joints”, Journal of Electronic Materials, Vol. 32(11), pp. 1284-1289. (SCI, EI), (NSC91-2214-E-007-013). (Impact factor: 1.457, 2003)
52. C.-H. Wang and *S.-W. Chen, 2003, "Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800oC", Metallurgical and Materials Transactions A, Vol. 34A, pp. 2281-2287. (SCI, EI), (NSC89-2623-7-007-007). (Impact factor: 1.285, 2003)
53. H.-Y. Chang, *S.-W. Chen, D. S.-H. Wong and H.-F. Hsu, 2003, "Determination of reactive wetting properties of Sn, Sn-Cu, Sn-Ag and Sn-Pb alloys by using a wetting balance technique", Journal of Materials Research, Vol. 18 (6), pp. 1420-1428. (SCI, EI), (NSC91-2214-E-007-013). (Impact factor: 1.635, 2003)
54. C.-M. Chen and *S.-W. Chen, 2003, "Electromigration effect upon the low-temperature Sn/Ni interfacial reactions", Journal of Materials Research, Vol. 18 (6), pp. 1293-1296. (SCI, EI), (NSC90-2214-E-007-001). (Impact factor: 1.635, 2003)
55. J.-I Lee, *S.-W. Chen, H.-Y. Chang and C.-M. Chen, 2003, "Reactive wetting between molten Sn-Bi and Ni substrate", Journal of Electronic Materials, Vol. 32 (3), pp. 117-122. (SCI, EI), (NSC89-2623-7-007-007). (Impact factor: 1.457, 2003)
56. *S.-W. Chen and C.-M. Chen, 2003, "Electromigration effects upon interfacial reactions", JOM, Vol. 55(2), pp.62-67. (SCI, EI), (NSC89-2623-7-007-007) (Impact factor: 0.852, 2003)
57. C.-H. Wang, *S.-W. Chen, C.-H. Chang and J.-C. Wu, 2003, "Phase equilibria of the ternary Al-Cu-Ni system and interfacial reactions of related systems at 800oC", Metallurgical and Materials Transactions A, Vol. 34A, pp. 199-209. (SCI, EI), (NSC90-2623-7-007-007). (Impact factor: 1.285, 2003)
58. H.-Y. Chen, *S.-W. Chen and S.-H. Wu, 2003, "Glass Formation, Physical Properties and Optical Properties of Ge-Se-Sn and Ge-Sb-Se-Sn Alloys", Materials Chemistry and Physics, Vol. 80, pp. 176 – 185. (SCI, EI), (88CS-D-007-010). (Impact factor: 1.183, 2003)
59. C.-H. Lin, *S.-W. Chen and C.-H. Wang, 2002, "Phase Equilibria and Solidification Properties of Sn-Cu-Ni Alloys", Journal of Electronic Materials, Vol. 31(9), pp. 907-915. (SCI, EI), (NSC89-2623-7-007-007)
60. C.-M. Chen and *S.-W. Chen, 2002, "Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures", Acta Materialia, Vol. 50(9), pp. 2461-2469. (SCI, EI), (NSC89-2214-E-007-006).
61. S.-J. Luo, C.-H. Wang and *S.-W. Chen, 2002, "Phase Equilibria of the Ternary Ni-Cr-Zr System and Interfacial Reactions in the Ni-Cr/Zr Couples", Metallurgical and Materials Transactions A, Vol. 33A, pp. 995-1002. (SCI, EI), (NSC88-TPC-7-007-006).
62. C.-Y. Huang and *S.-W. Chen, 2002, "Interfacial reactions in In-Sn/Ni couples and phase equilibria of In-Sn-Ni system", Journal of Electronic Materials, Vol. 31(2), pp. 152-160. (SCI, EI), (NSC89-2214-E-007-006).
63. C.-T. Lee and *S.-W. Chen, 2002, "Quantities of Grains and Those of TiB2 and Al3Ti Particles Added in the Grain-Refining Processes", Materials Science and Engineering A, Vol. 325 (1-2), pp. 243-249. (SCI, EI),
64. *S.-W. Chen and Y.-W. Yen, 2001, "Interfacial Reactions in the Sn-Ag/Au Couples", Journal of Electronic Materials, Vol. 30(9), pp. 1133-1137. (SCI, EI),
65. C.-M. Chen and *S.-W. Chen, 2001, "Electromigration Effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions", Journal of Applied Physics, Vol. 90(3), pp. 1208-1214. (SCI, EI),
66. C.-H. Wang, *S.-W. Chen, C.-H. Chang, and J.-C. Wu, 2001, "Phase Transformations at the Coating-Substrate Interface in Thermal Spraying", Journal of Chinese Foundrymen''s Association Quarterly, Vol. 27(1), pp. 12-16.
67. C.-H. Chen, *S.-W. Chen, and J.-L. Wang, 2001, "Properties of As-Te Alloys and Their Interfacial Reactions with Zn Substrate", Materials Chemistry and Physics, Vol. 70(3), pp. 316-325. (SCI, EI),
68. C.-M. Chen and *S.-W. Chen, 2000, "Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions", Journal of Electronic Materials, Vol. 29(10), pp. 1222-1228. (SCI, EI), (NSC89-2214-E-007-006).
69. *S.-W. Chen, C.-S. Ho, C.-H. Lin, and C.-M. Chen, 2000, "The 900oC Isothermal Section of Ti-Ni-V Alloys", Metallurgical and Materials Transactions A, Vol. 31A, pp. 1679-1682. (NSC88-2216-E-007-039). (SCI, EI),
70. *S.-W. Chen and S.-J. Luo, 2000, "Interfacial Reactions in Pt/Ti, Pt/Zr, Pt/TiO2 and Pt/ZrO2 Couples", Industrial & Engineering Chemistry Research, Vol. 39(2), pp. 547-549. (NSC87-CPC-E-007-010). (SCI, EI),
71. Y.-W. Yen and *S.-W. Chen, 2000, "Ni and Cu Deposition on Fine Alumina Particles by using the Chemical Vapor Deposition-Circulation Fluidized Bed Reactor", Journal of Materials Science, Vol. 35, pp. 1439-1444. (SCI, EI), (NSC85-2214-E-007-023).
72. C.-H. Chen, *S.-W. Chen, and J.-L. Wang, 1999, "Interfacial Reactions in As-Te/Zn and As-Si-Te/Zn Systems", Chinese Journal of Materials Science, Vol. 31(3), pp. 160-165.
73. *S.-W. Chen and Y.-W. Yen, 1999, “Interfacial Reactions in the Ag-Sn/Cu Couples”, Journal of Electronic Materials, Vol. 28(11), pp. 1202-1207. (SCI, EI), (NSC87-2214-E-007-021).
74. Y.-M. Dai, *S.-W. Chen, C.-H. Chen and J.-L. Wang, 1999, “Glass Formation, Density, Microhardness, and Optical Properties of As-Si-Te Chalcogenide Alloys”, Journal of Non-Crystalline Solids, Vol. 255, pp. 217-227. (SCI, EI),
75. C.-M. Chen and *S.-W. Chen, 1999, “Electric Current Effects Upon the Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906. (SCI,EI), (NSC87-2214-E-007-021).
76. *S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, "The Electric Current Effects Upon the Sn\Cu and Sn\Ni Interfacial Reactions", Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198. (NSC87-2214-E-007-021).
77. *S.-W. Chen, C.-C. Lin, and C.-M. Chen, 1998, "Determination of the Melting and Solidification Characteristics of Solders by Using DSC", Metallurgical and Materials Transactions A, Vol. 29A, pp. 1965-1972. (NSC87-2214-E-007-021).
78. B.-R. Shie, *S.-W. Chen, and J.-L. Wang, 1998, "Interfacial Stability of the As-Se-S/ZnS, As-Se-S/ZnSe, As-Se-Tl/ZnS, As-Se-Tl/ZnSe and Related Systems", Journal of Non-Crystalline Solids, Vol. 231, pp.240-250.
79. W.-C. Liu, *S.-W. Chen and C.-M. Chen, 1998, "The Al\Ni Interfacial Reactions Under the Influence of Electric Current", Journal of Electronic Materials, Vol. 27(1), L5-L8. (NSC86-2745-E-007-005R).
80. S.-D. Ho, Y.-M. Dai, *S.-W. Chen, and J.-L. Wang, 1997, "Microstructure, Density and Microhardness of the As-Se-Tl Chalcogenide Glass", Journal of Non-Crystalline Solids, Vol. 221, pp. 290-296, 1997.
81. *S.-W. Chen, M.-H. Lin, B.-R. Shie, and J.-L. Wang, 1997, “Interfacial reactions in As-Se/Zn”, Journal of Non-Crystalline Solids, Vol. 220, pp. 243-248. (NSC 85-2815-C007-01-028E).
82. L.-H. Su, Y.-W. Yen and *S.-W. Chen, 1997, “Interfacial Reactions in the Molten Sn/Cu and Molten In/Cu Couples”, Metallurgical and Materials Transactions B, Vol. 28B, pp. 927-934. (NSC 83-0115-C007-01-006E and NSC 86-2745-E-007-005R).
83. S.-C. Jeng and *S.-W. Chen, 1997, "The Solidification Characteristics of the 6061 and A356 Aluminum Alloys and Their Ceramic Particle-Reinforced Composites", Acta Materialia, Vol. 45(12), pp. 4887-4899. (NSC85-2216-E-007-042)
84. C.-C. Chen and *S.-W. Chen, 1997, “Nickel and Copper Deposition on Al2O3 and SiC Particulates by Using the Chemical Vapor Deposition-Fluidized Bed Reactor Technique”, Journal of Materials Science, Vol. 32, pp. 4429-4435. (NSC-84-2214-E-007-019)
85. *S.-W. Chen and S.-C. Jeng, 1997, “Determination of the Solidification Curves of a Rene N4 Superalloy”, Metallurgical and Materials Transactions A, Vol. 28A, pp. 503-504. (NSC 85-2216-E007-042)
86. H.-T. Luo and *S.-W. Chen, 1996, "Phase Equilibria of the Ternary Ag-Cu-Ni System and the Interfacial Reactions in the Ag-Cu/Ni Couples", J. Materials Science, Vol. 31(19), pp. 5059-5067. (NSC 82-0405-E-007-285)
87. *S.-W. Chen and S.-C. Jeng, 1996, "Determination of the Solidification Curves of Commercial Aluminum Alloys", Metallurgical and Materials Transactions A, Vol. 27A, pp. 2722-2726. (NSC 84-2216-E-007-027)
88. *S.-W. Chen and C.-C. Huang, 1996, "Solidification Curves of Al-Cu, Al-Mg, and Al-Cu-Mg Alloys", Acta Materialia, Vol. 44(5), pp. 1955-1965. (NSC 83-0405-E-007-007)
89. C.-C. Chen and *S.-W. Chen, 1995, "Surface Treatment of Particles by Using Fluidized Bed Technology", Journal of the Chinese Institute of Chemical Engineers, Vol. 26(5), pp. 263-267. (NSC 83-0402-E-007-018)
90. C.-L. Tsao and *S.-W. Chen, 1995, "Interfacial Reactions in the Liquid Diffusion Couples of Mg/Ni, Al/Ni, and Al/(Ni)-Al2O3 Systems", Journal of Materials Science, Vol. 30, pp. 5215-5222. (NSC 83-0402-E-007-018)
91. C.-C. Huang and *S.-W. Chen, 1995, "Phase Equilibria of Al-rich Al-Cu-Mg Alloys", Metallurgical and Materials Transactions A, Vol. 26A, pp. 1007-1011. (NSC 83-0405-E-007-007)
92. *S.-W. Chen, C.-C. Huang and J.-C. Lin, 1995, "The Relationship between the Peak Shape of a DTA Curve and the Shape of a Phase Diagram", Chemical Engineering Science, Vol. 50(3), pp. 417-431. (NSC 82-0405-E-007-130)
93. *R.-F. Kuo, J.-J. Wu, W.-H. Lo, Y.-C. Tsui, H.-M. Chen and S.-W. Chen, 1995, "The effect of hole size on the spiral fracture of cortical bone in a tubular torsional model", Chinese Journal of Medical and Biological Engineering, Vol. 15(3), pp. 179-187.
94. *S.-W. Chen, 1993, "Interfacial Reactions in the Liquid (Ag,Cu)/Ni Diffusion Couples", Materials Chemistry and Physics, Vol. 33, pp. 271-276.
95. C.R. Kao, A. Bolcavage, S.-L. Chen, S.-W. Chen, *Y.A. Chang, and A. D. Roming, Jr., 1993, "Phase Equilibria of the Cu-In System ,II：Thermodynamic Assessment and Calculation of Phase Diagram", J. of Phase Equilibria, Vol. 14(1), pp. 22-30.
96. A. Bolcavage, S.-W. Chen, C.R. Kao, *Y.A. Chang, and A. D. Roming, Jr., 1993, "Phase Equilibria of the Cu-In System, I：Experimental Investigation", J. of Phase Equilibria, Vol. 14(1), pp. 14-21.
97. S.-W. Chen and *Y. A. Chang, 1992, "Microsegregation in Solidification of Ternary Alloys", Metallurgical Transactions A, Vol. 23A, pp. 1038-1043.
98. S.-W. Chen, Y.Y. Chuang, *Y.A Chang and M.G. Chu, 1991, "Calculation of Phase Diagrams and Solidification Paths of Al-rich Al-Li-Cu Alloys", Metallurgical Transactions A, Vol. 22A, 2837-2848.
99. S.-W. Chen and *Y. A. Chang, 1991, "Application of Thermodynamic Models to the Calculation of Solidification Paths of Al-rich Al-Li Alloys", Metallurgical Transactions A, Vol. 22A, 267-271.
100. S.-W. Chen, H.W. Beumler and *Y.A. Chang, 1991, "Experimental Determination of the Phase Equilibria of Aluminum-Rich Al-Li-Cu Alloys", Metallurgical Transactions A, Vol. 22A, 203-213.
101. S.-W. Chen, C.-H. Jan, J.-C. Lin and *Y.A. Chang, 1989, "Phase Equilibria of the Al-Li Binary System", Metallurgical Transactions A, Vol. 20A, 2247-2258.
B.研討會論文
1. S.-W. Chen, S.-K. Lin, C.-N. Chiu and Y.-C. Huang, "Electromigration effects upon interfacial reactions in teh Pb-free solder joints", 2006 International Conference on Chemical and Molecular Technologies, (Invited lecture), Dec. 9, 2006,Tainan.
2. 趙益祥、陳信文、張志鴻，2006，”Sn-Co-Ni之合金相平衡及其界面反應”，2006中國材料科學學會論文集(光碟)，P03-049.
3. 訾安仁、陳信文，2006，”錫-銻-銅三元系統在250oC之相平衡與錫-銻/銅界面反應”，2006年中國化學工程學會年會論文全集(光碟)，8-P08
4. 陳伯胤、陳信文，2006，”錫-銻-界面反應與錫-銻-銀相平衡”， 2006年中國化學工程學會年會論文全集(光碟)，8-P08
5. Ching-feng Yang and Sinn-wen Chen, “Sn-Zn-Bi銲料之界面反應與濕潤性”, 2006台灣化學工程學會第53屆年會國科會化工學門成果發表研討會論文集(光碟)，4-P37.
6. Ching-feng Yang and Sinn-wen Chen, “ Interfacial Reactions in the Sn-20at.%In/Ag Couples and Phase Equilibria of the Sn-In-Ag Ternary System”, 2006國際微電子暨構裝學會台灣分會國際研討會論文集(光碟)
7. 黃育智、陳信文，2006，“無鉛波焊中的界面反應”, 台灣化學工程學會第五十三屆年會曁國科會化學工程學門成果發表會(光碟)，4P-11.
8. Y.-C. Huang and S.-W. Chen, 2006, "Interfacial Reactions in the Lead-Free Wave Soldering", IMAPS-Taiwan 2006 international technical symposium.
9. Y.-C. Huang, S.-W. Chen, S.-K. Lin, C.-H. Chang and J.-C. Wu, 2006, "Heat Treatment of the Spray Objects", TMS Annual Meeting, March 2006, Technical Division Student Poster Contest, SMD-Grad-54
10. 陳信文、邱政男、王朝弘、林士剛、陳志吉，2006，“無鉛銲點界面反應與其相圖”， 2006中國材料科學學會論文集(光碟)，F05-09.
11. 邱政男、陳信文，2006，“Sn-(Bi)/Te液固界面反應之探討”，2006中國材料科學學會論 文集(光碟)，P03-046.
12. S.-W. Chen and C.-N. Chiu, 2006, “Interfacial reactions in the Sn/Te couples”, Presented at the 2006 E-MRS Fall meting, September 2006,Warsaw, Poland.
13. 王朝弘、陳信文，" 電流作用對Sn/Cu界面反應之影響"，2006年中國材料學會年會論文摘要集(光碟)，P03-048.
14. S.-W. Chen, P.-Y. Chen and C.-H. Wang, 2006, "Melting point lowering of the Sn-Sb alloys caused by substrate dissolution", Presented at the 135th TMS Annual Meeting, San Antonio, Texas.
15. C.-H. Wang and S.-W. Chen,2006, "Cu diffusion in Sn/Cu couples by electromigration", Presented at 2006 EMRS fall meeting, Warsaw, Poland.
16. C.-H. Wang and S.-W. Chen, 2006, "Cu content and size effects upon the reaction layer detachment in the Sn-Cu/Ni couples", Presented at the 135th (TMS 2005) TMS Annual Meeting, San Antonio, Texas.
17. 林士剛、陳信文，2006，””，2006 台灣化學工程學會五十三週年 (94年年會)曁國科會化學工程學門成果發表會(光碟)，8P-17.
18. Shih-kang Lin, Yuhi Yorikado, Keun-Soo Kim, Katsuaki Suganuma, Sinn-wen Chen, Masanobu Tsujimoto and Isamu Yanada, 2006, “Sn Whiskers Growth on Electroplated Lead-free Solder Finish for Advanced Flexible Electronic Packaging”, Presented at the Sanken International Symposium on Nanoscience and Nanotechnology-2006 (SISNN-2006), September 19-20 2006, Osaka, Japan.
19. Shih-kang Lin, and Sinn-wen Chen, 2006, “Liquidus projection and solidification of the Sn-In-Cu ternary alloys”, Presented at the International Microelectronic and Packaging Society-Taiwan 2006 (IMAPS-Taiwan 2006), June 28-July 1, 2006, Taipei, Taiwan.
20. Yu-Chih Huang, Sinn-Wen Chen, Shih-Kang Lin, Chia-Hua Chang, and Jen-Chin Wu, 2006, “Heat Treatment of the Thermal Spray Objects”, Presented at the 135th TMS Annual Meeting & Exhibition (TMS 2006), March 12-16, 2006, Henry B. Gonzales Convention Center, San Antonio, Texas, USA.
21. Shih-kang Lin and Sinn-wen Chen, 2006, “Electromigration induced High Reactive Diffusion Path in Sn-In/Cu Joints”, Presented at the 135th TMS Annual Meeting & Exhibition (TMS 2006), March 12-16, 2006, Henry B. Gonzales Convention Center, San Antonio, Texas, USA.
22. Shih-kang Lin and Sinn-wen Chen, 2006, “Current direction effects upon interfacial reactions in the Sn-In/Cu joints”, Presented at the 135th TMS Annual Meeting & Exhibition (TMS 2006), March 12-16, 2006, Henry B. Gonzales Convention Center, San Antonio, Texas, USA.
23. 陳志吉、陳信文，2006，” Sn/Ni-7wt.%V固態反應偶之反覆性生成相”, 2006中國材料科學學會論文集(光碟)，P03-045.
24. 周沁怡、陳信文，2005，”錫-鋅-銅無鉛銲料與銅、鎳之界面反應”，2005中國材料科學學會論文集(光碟)，2-1-P-058.
25. 陳鳳鴒、陳信文、謝克昌，2005，”Sn-Cu無鉛銲料之熱力學性質量測”，2005中國材料科學學會論文集(光碟)，2-1-P-019.
26. 陳伯胤、王朝弘、陳信文，2005，”錫-銻/銀界面反應”，2005中國材料科學學會論文集(光碟)，2-1-P-004.
27. 楊青峰、訾安仁、陳信文，2005，”錫-鎳-磷三元系統相圖”，2005中國材料科學學會論文集(光碟)，2-1-P-003.
28. 黃育智、陳信文、張家華、吳貞欽，2005，“熔射物件之熱處理”, 國防部軍備局中山科學研究院94年度國防科技學術合作計劃成果發表會論文集.
29. 王朝弘、陳信文，2005，”Sn-0.7wt%/Cu/Ni在250℃之界面反應”，2005中國材料科學學會論文集(光碟)，2-1-I-002.
30. 林士剛、陳信文，2005，”電流方向對In-Sn/Cu界面反應的影響”，2005中國材料科學學會論文集(光碟)，2-1-O-004.
31. 黃育智、陳信文、張家華、吳貞欽，2005，”熔射物件之界面反應”, 中國化學工程學會五十二週年 (94年年會)曁國科會化學工程學門成果發表會(光碟)，OM-2.
32. 陳志吉、陳信文，2005，”溫度效應對錫與鎳-7wt.%釩之界面反應之影響”, 中國化學工程學會五十二週年 (94年年會)曁國科會化學工程學門成果發表會(光碟)，OT-2.
33. 林士剛、陳信文，2005，”溫度效應在銦錫合金對鎳之固態界面反應的影響”, 中國化學工程學會五十二週年 (94年年會)曁國科會化學工程學門成果發表會(光碟)，OM-1.
34. 陳信文、王朝弘、林士剛、陳志吉，2005，”電流效應對電子產品中界面反應之影響”, (Invited speech), 中國化學工程學會五十二週年 (94年年會)曁國科會化學工程學門成果發表會(光碟)，pp.28.
35. C.-H. Wang and S.-W. Chen, "Electric current effects in the flip chip solder joints", IMAPS-Taiwan 2005 international technical symposium proceeding and CD, pp.190-192.
36. S.-K. Lin, T.-Y. Chung, C.-F. Yang and S.-W. Chen, "Interfacial reactions in the Sn-20at.%In/Cu couples and phase equilibria of the In-Sn-Cu ternary system", IMAPS-Taiwan 2005 international technical symposium proceeding and CD, pp.149-154.
37. C.-C. Chen, S.-W. Chen and C.-Y. Kao, 2005, "Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-rich corner", Presented at the 134th (TMS 2005) TMS Annual Meeting, March 2005, San Francisco, California.
38. C.-Y. Chou and S.-W. Chen, 2005, "Interfacial reactions and phase equilibria in the Al-Cu/Ta systems", Presented at the 134th (TMS 2005) TMS Annual Meeting, March 2005, San Francisco, California.
39. S.-W. Chen, C.-H. Wang, C.-C. Chen, and S.-K. Lin, 2005, "Electric current effects upon interfacial reactions in the solder joints", (Invited speech), Presented at the SEMICON Korea 2005, February, 2005 , Seoul, Korea.
40. S.-W. Chen, 2005, " Phase Equilibria of Sn-Ag-Cu-Ni and Sn-In-Cu-Ni Systems", COST Materials, Action 531, February 24-26, 2005, Lausanne, Switzerland.
41. S.-W. Chen, S.-K. Lin and C.-F Yang, 2005, "Interfacial reactions in the Pb-free composite solders with indium layers”, Presented at the 134th (TMS 2005) TMS Annual Meeting, March 2005, San Francisco, California.
42. 鍾定穎、陳信文，2004，”In-Sn-Cu三元系統相平衡”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 1439-1442.
43. 楊喬陵、陳信文，2004，” 牙齒矯正線之表面處理”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 469-472.
44. 林士剛、M. Marin、陳信文，2004，”In-Sn/Cu與In-Sn/Ni的界面反應”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 399-402.
45. 邱政男、陳信文，2004，” Sn-Ag-Cu-Ni四元系統之相平衡”， 2004年中國化學工程學會年會論文全集(光碟)，pp. 13-16.
46. S.-W. Chen, S.-K. Lin and C.-F. Yang, 2004, “Lead-free composite solder with an indium layer”, (Invited speech), 2004年中國材料學會年會論文集(光碟)，OB1-06.
47. C.-Y. Chou and S.-W. Chen, 2004, “Interfacial reactions in the Al-Ta couples”, 2004年中國材料學會年會論文集(光碟)，OB1-03.
48. C.-F. Yang, T.-Y. Chung, Y.-M. Tsai and S.-W. Chen, 2004, 2004年中國材料學會年會論文集(光碟)，PB1-044.
49. C. A. Chang, Y.-C. Huang and S.-W. Chen, 2004, “Solidification of the quaternary Sn-Ag-Cu-Ni alloys”, (Invited speech), Presented at the Materials Science and Technology 2004 (TMS Fall) Meeting, September 26-29, 2004 , New Orleans, Louisiana.; 2004年中國材料學會年會論文集(光碟)，PB1-051.
50. S.-W. Chen, C.-A. Chang and M. Gueguen, 2004, “Liquidus projection of the quaternary Sn-Ag-Cu-Ni system and the alloy’s phase formation sequence during solidification”, presented at the 16th International Congress of Chemical and Process Engineering, CHISA 2004 Summaries 2, (D 3.8), pp. 530-531, August 22-26, 2004, Praha, Czech Republic.
51. 陳信文，”相圖、電遷移、與界面反應”，2004, (Invited speech), 無鉛銲料研發成果及展望研討會，成功大學，February 27, 2004。
52. S.-W. Chen, “Electromigration effects upon the Pb-free solder/Nickel interfacial reactions in the electronic products”, (Invited speech), Second 21st Century COE, “Towards Creating New Industries Based on Inter-Nanoscience”, 7th Sanken International Symposium on Hybridization of Chemistry, Biology and Materials Science, pp. 40-41, January 13-14, 2004, Osaka, Japan.
53. 張辰安、Mathieu Gueguen、陳信文，2003，”Sn-Ag-Cu-Ni四元系統相平衡圖與液相線投影”，中國材料科學學會2003年年會論文集(光碟)，PM-013.
54. 林士剛、陳信文，2003，”電遷移對Sn/Cu/Ni/Sn/Cu/Sn界面反應之影響”，中國材料科學學會2003年年會論文集(光碟)，OM-004.
55. 張辰安、陳信文，2003，”富錫區錫-銀-銅-鎳之相平衡”, 中國化學工程學會五十週年慶(92年年會)曁國科會化學工程學門成果發表會(光碟)，5-08.
56. 林子瑋、陳信文，2003，”鈦鎳合金的Pourbaix圖”, 中國化學工程學會五十週年慶(92年年會)曁國科會化學工程學門成果發表會(光碟)，5-07.
57. 高靖雅、饒瑞孟、陳信文，2003，”電流對銲料中不連續相偏析之影響”, 中國化學工程學會五十週年慶(92年年會)曁國科會化學工程學門成果發表會(光碟)，3-36.
58. S.-W. Chen, S.-W. Lee, C.-H. Wang and M.-C. Yip, ”Relationship between mechanical properties and intermetallic compound formation at the Sn-0.7(0.5, 0.3, 0.1)wt%Cu/Ni joints” (Invited speech), Presented at the 132nd (TMS 2003) TMS Annual Meeting, March 2003, San Diego, California.
59. 陳信文、許秀鳳、申有田、顏怡文，2002，"銀-錫/銅與錫-銦/銅系統界面反應的熱力學與動力學探討"，2002年中國化學工程學會年會暨專題研討會論文集(光碟)，C_19.
60. Loic Lerouge、饒瑞孟、陳信文、楊立明、陳志銘，2002，"錫-釩二元系統相平衡及錫/釩反應偶之界面反應"，2002年中國材料學會年會論文集(光碟)，OJ-12-演B.
61. 許秀鳳、陳信文，2002，"錫-銀-鎳三元相平衡圖與錫-銀/鎳界面反應"，2002年中國材料學會年會論文集(光碟)，OJ-10-演B.
62. 李守維、陳信文，2002，"Sn/(Cu,Ni)反應偶之界面反應"，2002年中國材料學會年會論文集(光碟)，OJ-7-演B.
63. S.-W. Chen, S.-H. Wu, C.-M. Chen and C.-H. Wang, 2002, "Electromigration effects upon the lead-free solder joints", Oral index #32 (CD), Presented at the 2002 Taiwan/Korea/Japan Chemical Engineering Conference, October 2002, Taipei, Taiwan.
64. S.-W. Chen, H-Y. Chang, J.-I Lee and E. Viard, 2002, "Determination of reactive wetting properties of Sn-Sn-Cu, Sn-Ag and Sn-Pb alloys by using a wetting balance technique", Presented at the 4th International Conference on Materials for Microelectronics and Nanoengineering, June 2002, Espoo Finland, Published by IOM communications, pp. 173-176.
65. S.-W. Chen and C.-H. Lin, “Phase equilibria and solidification properties of Sn-Cu-Ni alloys”, (Invited speech), Presented at the 131st (TMS 2002) TMS Annual Meeting, February 2002, Seattle, Washington.
66. 陳信文，2002，"無鉛銲錫接點之界面反應"，海峽兩岸清華大學化學工程學系學術研討會論文集，p. 17.
67. 陳信文、陳志銘、王朝弘，2002，"無鉛銲料系統之相平衡與界面反應研究"，第二屆海峽兩岸清華大學先進材料研討會論文集，pp. 218-219.
68. 王朝弘、李守維、陳信文、顧詩章，2002，"覆晶銲料隆點之界面反應探討"，中華民國第七屆破壞科學研討會論文集 (光碟)，B4-07.
69. 陳志銘、陳信文，2001，"往返電流對界面影響之模擬計算"，第二十三屆輸送現象與其應用專題研討會專輯， pp.105-108.
70. 陳信文、申有田、吳時涵，2001，"銦-錫-銅三元合金之液相線投影與固化性質"，2001年中國化學工程學會年會暨專題研討會論文集，pp. 67-70.
71. 張秀玉、E. Viard、李柔儀、陳信文，"以濕潤天平量測Sn、Sn-Cu、與Sn-Pb之濕潤性"，2001年中國材料學會年會論文摘要集，P10-12, p. 236.
72. 王朝弘、陳信文、張家華、吳貞欽，"Sn-Cu-Ni三元系統相平衡及界面反應"，2001年中國材料學會年會論文摘要集，P02-12, p. 34.
73. 王朝弘、陳信文、張家華、吳貞欽，"Al-Cu-Ni三元系統在800oC下的相平衡及界面反應"，2001年中國材料學會年會論文摘要集，P02-11, p. 34.
74. C.-M. Chen, S.-W. Chen and M.-Y. Du, 2001, “Effects upon Interfacial Reactions by Electric Currents of Alternating Directions”, Presented at the 2001 TMS Fall Meeting, Indianapolis, Indiana, USA；2001年中國材料學會年會論文摘要集，O10-02, p. 229.
75. S.-W. Chen, 2001, “Phase transformations and interfacial reactions in electronic materials”, Invited speech, Presented at the 2001 ChemTech Conference, Chicago, Illinois, USA. Conference Booklet, pp. 18-19.
76. 陳志銘、杜美瑤、陳信文，2001，"電遷移對銲點界面反應的影響"，海峽兩岸清華大學先進材料研討會論文集，pp. 235-242.
77. C.-M. Chen, S.-W. Chen and M.-Y. Du, 2001, “Electromigration effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni interfacial reactions”, Presented at the 130th TMS Annual Meeting, New Orleans, Louisiana, USA.
78. S.-W. Chen and Y.-W. Yen, 2001, “Interfacial reactions in the Ag-Sn/Au couples”, Invited speech, Presented at the 130th TMS Annual Meeting, New Orleans, Louisiana, USA.
79. 王朝弘、陳信文、張家華、與吳貞欽，2000，"熔射製程中鍍層與基材界面之相變化"，中華民國鑄造學會八十九年度論文發表會論文集，pp. 233-236 (NSC89-2623-7-007-007).
80. C.-M. Chen and S.-W. Chen, 2000, “Interfacial Reactions in Zn/Ni and Bi/Ni Couples”, Presented at the 129th TMS Annual Meeting, Nashville, Tennessee, USA.
81. S.-W. Chen and C.-W. Huang, 2000, “Interfacial Reactions in In-Sn/Ni Couples and Phase Equilibria of In-Sn-Ni System”, Presented at the 129th TMS Annual Meeting, Nashville, Tennessee, USA.
82. 郭政雨、呂世源、周更生、與陳信文，2000，"Heat Dissipating Performance of Reticulated Aluminum Structures", The 2000 CIChE Annual Meeting and Conferences, Proceedings 2000 Symposium on Transport Phenomena and Applications, pp. 309-312.
83. 周更生、劉建偉、宋敏安、陳信文、與呂世源，2000，"以泡棉為模子製備密度鋁金屬網體"，中國材料科學學會89年會論文集 (光碟)，B-46P.
84. 劉建偉、宋敏安、周更生、陳信文、與呂世源，2000，"以鹽粒子製備低密度多孔金屬鋁之研究"，中國材料科學學會89年會論文集 (光碟)，B-41P.
85. 陳志銘與陳信文，2000，"不同溫度下電遷移對錫/鎳與錫/銀界面反應的影響"，中國材料科學學會89年會論文集 (光碟)，H-07.
86. 顏怡文與陳信文，2000，"錫-銀合金與金基材的界面反應"，中國材料科學學會89年會論文集 (光碟)，H-03.
87. 顏怡文與陳信文，2000，"無鉛銲料與基材的界面反應"，中華民國第六屆破壞科學研討會論文集 (光碟)，H-3.
88. 顏怡文與陳信文，1999，"銀-錫-銅三元系統在450℃與240℃的相平衡"，中國材料科學學會88年會論文集 (光碟)，L-06.
89. 陳志銘與陳信文，1999，"電遷移效應對鋅/鎳與鉍/鎳界面反應的影響"，中國材料科學學會88年會論文集 (光碟)，H-48.
90. 羅士杰、王朝弘與陳信文，1999，"鎳-鉻合金與鋯的界面反應"，中國材料科學學會88年會論文集 (光碟)，B-35.
91. 李正德、陳信文與楊志超，1999，"Al3Ti與TiB2添加量對鋁合金細晶化之影響"，中國材料科學學會88年會論文集 (光碟)，B-18.
92. 陳志銘、陳信文、何俊昇與林志豪，1999，"鈦-鎳-釩三元合金相平衡"，1999中國化工學會年會化學工程技術研討會專輯， pp. 357-360. (NSC88-2216-E-007-039)
93. 李正德、陳信文與楊志超，1999，"純鋁、Al-3wt％Mg及Al-7wt％Si合金之細晶研究"，1999中國化工學會年會化學工程技術研討會專輯， pp. 269-272.
94. 陳心怡、陳信文與王進龍，1999，"鍺-銻-硒-錫硫屬玻璃性質之研究"，1999中國化工學會年會化學工程技術研討會專輯， pp. 5-8. (88-CS-D-007-010)
95. 黃清育與陳信文，1999，"銦/鎳與銦-錫/鎳反應偶的界面反應"，1999中國化工學會年會輸送現象與其應用專題研討會專輯， pp. 115-118. (NSC89-2214-E-007-006)
96. S.-W. Chen and Y.-W. Yen, 1999, “Phase Diagram Calculation and Its Applications”, Invited speech, Presented at Workshop on Computational Materials Science, National Center for High-Performance Computing, Hsin-Chu, Taiwan, ROC.
97. Y.-W. Yen and S.-W. Chen, 1999, “Interfacial Reactions in the Ag-Sn/Cu Couples”, Invited speech, Presented at the 128th TMS Annual Meeting, San Diego, California, USA. (NSC87-2214-E-007-021).
98. 陳志銘與陳信文，1998，"電遷移效應對質傳現象之影響"，1998輸送現象與其應用專題研討會專輯， pp. 183-186. (NSC87-2214-E007-021)
99. 顏怡文與陳信文，1998，"銀–錫合金與銅基材的界面反應"，中國材料科學學會1998年度年會論文集(第H冊)， pp. 63-66. (NSC86-2745-E007-005R)
100. 陳建豪、陳信文與王進龍，1998，"As-Te/Zn及As-Si-Te/Zn的界面反應"，中國材料科學學會1998年度年會論文集(第H冊)， pp.49-52. (CS87-0210-D-007-002)
101. 陳志銘與陳信文，1998，"電流對錫/銀界面反應的影響"，中國材料科學學會1998年度年會論文集(第H冊)， pp.7-10. (NSC87-2214-E007-021)
102. S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, "The Electric Current Effects Upon the Sn\Cu and Sn\Ni Interfacial Reactions", Presented at the 127th TMS Annual Meeting, San Antonio, Texas, USA. (NSC87-2214-E-007-021).
103. 顏怡文與陳信文，1997，"熔融銀–錫銲料與銅基材的界面反應"，1997輸送現象與其應用專題研討會專輯， pp. 427-432. (NSC86-2745-E007-005R)
104. 陳志銘、劉文銓與陳信文，1997，"電流對錫/鎳界面反應的影響"，1997輸送現象與其應用專題研討會專輯， pp. 195-200. (NSC87-2214-E007-021)
105. 陳建豪、陳信文與王進龍，1997，"As-82.1wt%Te/Zn的界面反應"，1997輸送現象與其應用專題研討會專輯， pp.171-175.
106. 戴逸明、陳信文與王進龍，1997，"高玻璃轉化點砷-矽-碲硫屬玻璃研究"，中國材料科學學會1997年度年會論文集(第F冊)， pp.83-86.
107. 陳信文、鄭世璋與林旻弘，1997，“鋁基複合材料的固化特性”, 中國材料科學學會1997年度年會論文集(第A冊)， pp.49-52. (NSC86-2216-E-007-025)
108. S.-W. Chen, 1997, "Determination of Solidification Curves of Alloys", Invited speech, Presented at the Australasia Pacific Forum on Intelligent Processing & Manufacturing of Materials, July 14-17, 1997, Proceedings of the IPMM''97, eds., T. Chandra, S. R. Leclair, J. A. Meech, B. Verma, M. Smith, and, B. Balachandran, pp. 1164-1170, Watson Ferguson & Co., Brisbane.
109. S.-W. Chen and M.-H. Lin, 1997, “Interfacial reactions in the As-Se/Zn couples”, Presented at the 126th TMS Annual Meeting, Orlando, Florida, USA. (NSC 85-2815-C007-01-028E).
110. 顏怡文與陳信文，1996，"以化學氣相沉積-循環式流體化床反應器進行氧化鋁粉粒表面鍍鎳與鍍銅"，1996輸送現象與其應用專題研討會專輯， pp. 191-196. (NSC85-2214-E-007-023)
111. 鄭世璋與陳信文，1996，“鋁合金的固化特性”, 中國材料科學學會1996年度年會論文集(第一冊)， pp. 439-440. (NSC85-2216-E-007-042)
112. S.-J. Jeng and S.-W. Chen, 1996, "Determination of the Solidification Characteristics of the A356.2 Aluminum Alloy", Presented at The Fifth International Conference on Aluminium Alloys, Grenoble, France. Proceedings of The Fifth International Conference on Aluminium Alloys, Materials Science Forum, Volumes 217-222, Part 1,eds., Driver, Dubost, Durand, Fougeres, Guyot, Sainfort, and Suery, pp. 283-288, Transtec Pub., Switzerland. (NSC85-2216-E-007-042)
113. S.-D. Ho, S.-W. Chen and J.-L. Wang, 1996, "The As-Se Chalcogenide Glass", APCChE ''96, Proceedings of The 7th Congress of the Asian Pacific Confederation of Chemical Engineers, Vol. 3, pp. 1030-1034.
114. 蘇立和與陳信文，1995， "電子構裝中界面反應的輸送現象"，1995年輸送現象與其應用研討會專輯，台北市臺灣大學， pp. 287-291。 (NSC83)
115. C.-C. Chen, S.-W. Chen and Yee-wen Yen, 1995, "Titanium Deposition on the Alumina Particles by Using CVD-FBR Technology", Presented at the 1995 AIChE Annual Meeting, Miami, FL, USA. AIChE Symposium Series Vol. 92 (313), Progress in Fluidization and Fluid Particle Systems, ed. D. King, AIChE, New York, pp. 96-99. (NSC84-2214-E-007-019)
116. 蘇立和、顏怡文、羅惠慈與陳信文，1995， "錫與銦和銅基材的界面反應",中國材料科學學會84年度年會，台中市中興大學，中國材料科學學會84年度年會論文集(下)， pp. 306-307。 (NSC83-0115-C007-01-006E)
117. 羅惠慈與陳信文，1995， "鎳基材與熔融銅銀合金的界面反應", 中國材料科學學會84年度年會，台中市中興大學，中國材料科學學會84年度年會論文集(上)，pp. 54-55。 (NSC82-0405-E-007-285)
118. S.-J. Jeng, S.-W. Chen, and C.-C. Huang, 1995, "Determination of the Solidification Curve of the 7075 Aluminum Alloy by Using DTA and Mathematical Modeling", Presented at the 124th TMS Annual Meeting, Las Vegas, NV, USA. Light Weight Alloys for Aerospace Applications III, eds., E. W. Lee, N. J. Kim, K. V. Jata, and W. E. Frazier, TMS, Warrendale, PA, pp. 219-216. (NSC84-2216-E-007-027)
119. C.-C. Chen and S.-W. Chen, 1994, "Surface Treatments of Particles by Using the Fluidized Bed Technology", Proceedings of Taipei-Kyushu Joint Symposium on Chemical Engineering & Symposium on Transport Phenomena and Applications, Taipei, pp.175-178. (NSC 83-0402-E-007-018)
120. S.-W. Chen and H.T. Luo, 1994, "Reactions of the (Ag,Cu) Braze with the Ni Substrate in the Microelectronic Joining Processes", Presented at the 123th TMS Annual Meeting, San Francisco, USA.
121. 陳信文，1994, "使用差比式熱分析儀(DTA)及數學模型來測定7000系列鋁合金的固化曲線", 第一屆「鑄造與鋼鐵材料研究成果及應用技術」研討會，台南市成功大學。
122. S.-W. Chen and Y.A. Chang, 1990, "Phase Equilibria and Solidification of Al-rich Al-Li-Cu Alloys", Presented at the 1990 MRS Spring Meeting, San Francisco, CA, USA. MRS Proceedings, Vol. 186, Alloy Phase Stability and Design, 1991, G.M. Stocks, D.P. Pope, and A.F. Giamei, eds., MRS, Pittsburgh, USA, pp.141-146.
123. S.-W. Chen, J.-C. Lin, Y.A. Chang and M.G. Chu, 1990, "Phase Equilibria and Solidification of Al-rich Al-Li-Cu Alloys", Presented at 119th TMS Annual Meeting, Anaheim, CA, USA. Light Metals 1990, C.M. Bickert, ed., TMS. Warrendale, PA, USA, pp. 985-988.
124. S.-W. Chen, Y.A. Chang and M.G. Chu, 1989, "Phase Equilibria and Solidification of Al-Li Alloys", Aluminum-Lithium Alloys, Proceedings of the Fifth International Al-Li Conference, T.H. Sanders, Jr. and E.A. Starke, Jr., eds., Materials and Component Engineering Publication Ltd., Birmingham, UK, pp. 585-594.
C.其他
1. 福岡義孝(原著) ，陳信文(審閱)，王姝雯(翻譯)，2005，"電子構裝技術" (ISBN 986-7688-37-6)，普林斯頓國際有限公司。
2. 陳信文、林士剛、楊青峰、黃育智、鍾定穎、蔡穎玫、訾安仁，2005，"軟焊兩基材的方法及其所形成的焊接點"，(中華民國專利審查通過領證中；美國發明專利申請號碼10/859207).
3. 陳信文、楊喬陵 、陳霽瑋，2005，"具多種顏色之金屬牙齒矯正線與其製備之方法"，(中華民國發明專利公開編號200520733；美國發明專利申請號碼10/810,800)
4. 陳信文，2004，” 使用無電遷移效應與低電遷移效應合金之電子產品及其合金設計方法”， (中華民國發明專利公開編號200422406；美國發明專利US2004208776)。
5. 周更生、宋敏安、劉建偉、陳信文、呂世源，2004，"連通性多孔鋁材的製造方法"， (中華民國發明專利 I223668)。
6. 陳信文、陳立軒、林永森、陳志銘 合著，2004，"電子構裝技術與材料" (ISBN 986-412-133-2)，高立圖書公司。
7. 陳信文、吳蒔涵、李守維、許秀鳳，2004，”無銲料的基礎性質(四)：機械性質與電遷移效應”，電子與材料，第二十一期，pp. 124-142。
8. 陳信文、吳蒔涵、許秀鳳、李守維，2003，”無鉛銲料的基礎性質(二)：界面反應與物理性質”，電子與材料，第十八期，pp. 144-150。
9. 陳信文、許秀鳳、吳蒔涵、李守維，2003，”無鉛銲料的基礎性質(三)：相平衡”，電子與材料，第十九期，pp. 132-139。
10. 陳信文、陳雙林， 2003，”相圖與其計算：以無鉛銲料為例”， 材料會訊，第十卷(第1期)，pp. 34-42。
11. 陳信文、吳蒔涵、許秀鳳、李守維，2003，”無鉛銲料的基礎性質(一)：反應潤溼”，電子與材料，第十七期，pp. 131-142。
12. 陳信文、陳立軒、林永森、陳志銘 合譯，2002，(原著 Tummala) "微系統構裝基礎原理" (ISBN 957-493-711-9)，高立圖書公司。
13. 陳信文，2002，"單晶、鑽石與奈米材料"，科學發展月刊，第352期，pp. 34-37。
14. 陳信文，2002，"八吋晶圓"，科學發展月刊，第355期，pp. 64-65。
15. 陳信文、謝博榮、林旻弘與王進龍，2001，"以界面反應來製作光學材料與元件"，(中華民國發明專利 I127730)。
16. 陳信文2000, "礦物、金屬、及材料學會年會"，科學發展月刊，第28卷第8期，pp. 639-641。
17. 陳志銘與陳信文，1999, "銲料與界面反應"，材料會訊，第六卷第2期，pp. 74-80。
18. 陳信文，1999, "電子構裝現況與發展"，材料會訊，第六卷第2期，pp. 3-4。
19. 陳信文，1999, "電子構裝中接點的界面反應與輸送現象"，工程科技通訊 (化工)，第37期，pp. 4-6。
20. 陳信文，1999, "無鉛銲料簡介"，電子與材料，創刊號，pp. 74-77。
21. 陳信文，1997, "氧化鋁的表面處理，與鋁基複合材料中、熔融鋁合金和氧化鋁的界面反應"，工程科技通訊 (化工)，第23期，pp. 1-2。
22. 陳信文，1996, "使用差比式熱分析儀(DTA)及數學模型來測定7000系列鋁合金的固化曲線"，工程科技通訊 (材料)，第17期，pp. 54-56。
23. 陳信文與許嘉翔，1996,"化工技術在積體電路構裝上的應用"，電子資訊，第2卷第4期， pp. 45-48。
24. 陳信文與金惟國，1995, "電子構裝材料介紹"， 工業材料 第102期，pp. 75-81。
25. 陳信文與葉宗壽，1994, "電子構裝介紹"， 化工技術 第16期， pp. 121-130。
26. D J. Chakrabarti, D. E. Laughlin, S.-W. Chen, and Y.A. Chang, 1990, "The Cu-Ni System", Binary Alloy Phase Diagrams, 2nd edition, Vol. 2, T. B. Massalski, et al., eds., ASM, Materials Park, Ohio, USA, 1442-1446, (1990).